Alloy

Melting Point Degree C

Comments

Sn100C

227

Stabilised Tin/Copper giving superior drainage to standard tin/copper

Sn99.3/Cu0.7

227

Cost -effective alternative for wave and hand soldering

Suffers from poor drainage

Sn97/Cu3

227-300

High Temperature applications only

(Plumbing)

Sn97/Sb3

232-238

Contains Antimony, poor wetting.

Sn95/Sb5

232-240

As Sn97/Sb3 Lower cost than Sn/Ag.

Sn/Ag3.5/Cu0.5

217-218

'SAC' alloy. Silver imparts higher cost for wave solder applications.

Sn/Ag3.8-4/Cu0.7

217-218

Higher silver content, as above.

Sn96.5/Ag3.5

221

Standard Tin/Silver eutectic. Long history in electronics for high temp. applications.

Sn95/Ag5

221-240

High Temp. applications.

Sn42/Bi57/Ag1

138

As Tin Bismuth eutectic, but better fatigue characteristics.

In52/Sn48

118

Low melting point applications

Sn42/Bi58

138

Low melting point. Low ductility due to Bismuth.

In97/Ag3

143

Low temperature alloy. Expensive due to

Indium.

Sn91/Zn9

199

Requires special fluxes. Corrosion problems.